Welcome to Power module design, packaging and testing


Power modules are the work-horses in car, wind, solar and drives applications. Power modules may be destroyed instantaneously however in applications lifetimes are expected to be 20 years. Strong and the same time fragile you need to understand the power modules to design them properly. This course bring you under the skin of power modules and introduces the multidisciplinary knowledge needed to understand packaging assembly processes, materials and layouts as well as failure mechanisms. From the application point of view lifetime monitoring and test methods are introduced
The course is conducted by physicists and engineers with experience from the university packaging laboratory building fex. 10kV SiC power modules, compact fast switching hybrid GaN power modules and with experience of analyzing and testing industry standard power modules and components for higher powers. The course will contain background information on packaging process simulation, worked examples and case studies of FEM based digital power module design and experimental validation as well as a day spent with experimental hands-on exercises related to packaging and physical analysis in the laboratories.

Day 1: Power modules, Packaging processes and design guidelines. CHU (2.5 hours), SBE (2.5 hours), SMN (1 hour)
Background tutorials and workshop session with worked example of FEM based digital power module design.
Day 2: Laboratory exercise and Design exercise. CHU 6 hours, SBE, 6 hours, , ABJ 6 hours (lab exercises running)
Experimental hands-on experience with packaging processes and physical analysis of prototypes built during exercises.
Day 3: Testing of Power modules and their packaging and example presentation of state of the art power module packaging design. SMN 2 hours, CHU 1 hour, SBE 2 hours, ABJ 2 hours
Packaging challenges case studies: Paralleling dies, Medium Voltage power modules and fast switching hybrid/integrated compact modules.

Prerequisites: Engineers and physicists open for multidisciplinary work. The course is based on the experience and learnings assembly power modules during a some years and therefore the course are intended people who are new to the packaging of power modules. The language will be English and the academic level will be for engineers and physicist the engineers are expected to know application converters and the physicist are expected to know materials and semiconductors.

Form of evaluation:
The attendants of the course will have to complete a simulation assignment and hand in a report reflectingon the experiment results in relation to the simulation results and the topics of the course.

Organizer: Christian Uhrenfeldt, Associate Professor


Christian Uhrenfeldt (CHU)
Szymon Beczkowski (SBE)
Asger Bjørn Jørgensen (ABJ)
Stig Munk Nielsen (SMN)


Time: 1-3 April 2020 New course dates: 22-24 June 2020


Zip code: 


Number of seats: 25

Deadline: 1 June 2020

Important information concerning PhD courses: We have over some time experienced problems with no-show for both project and general courses. It has now reached a point where we are forced to take action. Therefore, the Doctoral School has decided to introduce a no-show fee of DKK 5,000 for each course where the student does not show up. Cancellations are accepted no later than 2 weeks before start of the course. Registered illness is of course an acceptable reason for not showing up on those days. Furthermore, all courses open for registration approximately four months before start. This can hopefully also provide new students a chance to register for courses during the year. We look forward to your registrations.